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Posted: Wednesday, February 7, 2018 10:41 PM

Req. ID:
Seeking a self:motivated, team:oriented high:speed board design engineer to develop Micron's next generation Solid State Drive (SSD) products. This position requires experience in hardware architecture, design, signal integrity; including modeling and simulation for high speed signaling implementations. A successful candidate will have a good working knowledge of: state of the art memory device technologies, interfaces such as SATA, SAS, PCIe Gen 3 and 4, ONFI and implementation techniques required for high:speed interfaces. Experience with PCB design tools (Cadence PCB design and analysis, including Si/Pi. Expertise in the design for optimum signal integrity as well as hands:on lab experience is a must. Also, a thorough understanding of hardware development methodologies to achieve a first pass design success.
Duties and Responsibilities:/h2:
:Interface in cross functional teams to ensure the design meets all firmware, diagnostic and system level requirements.
:Participate in architecture definition, design reviews, requirements generation of SSD products.
:Perform basic SI measurements, such as TDR, TDT, crosstalk, jitter, eye pattern and power plane noise measurements to validate SI and power integrity (PI) designs.
:Document and communicate results with cross functional counterparts.
:Simulate and analyze design proposals, review results and provide recommendations on optimal design practices to other design engineers.
:Experienced in designing hardware for large scale manufacture, including DFx and low cost considerations
:Hardware design, worst:case analysis, simulations, capture schematic, de:rating and assumes complete ownership of the SSD hardware thru the product lifecycle.
:PCB back:end process: defining stack:up and via technologies, part placement, setting design constraints, signal integrity and power integrity analysis
:Works proactively with cross functional team members during design, verificationas well as on RMAs
:In addition to design, a successful candidate will mentor and provide technical guidance to other hardware team members
Critical Skills
:Self:motivated. Desire to take on challenges. Result:driven and details oriented.
:Strong interpersonal and communication skills are a must.
:Strong in transmission line fundamentals. Understand the fundamentals of time:domain vs. frequency:domain.
:In depth knowledge in circuit designs, as well as semiconductor design.
:Good PCB design experience on high speed signals routing guideline and review, power copper routing and review, design for EMI/ESD protection.
:Design for signal integrity, including SerDes, power and interconnect.
:Develops solutions to complex signal integrity problems, which require ingenuity and creativity.
:Simulation skills with SPICE and IBIS. Experience with Hspice.
:Practical experience with design tools:
:Cadence Sigrity, Allegro Power:Aware SI
:Mentor Graphics HyperLynx
:Practical lab SI analysis experience using:
:High:bandwidth measurements (20:35GHz) via:
:Teledyne Lecroy SDA820Zi:B Oscilloscope
:Agilent MSO:X 92004A Oscilloscope
:PCIe Compliance equipment (requires also using one of the following test equipment)
:Teledyne Lecroy PER:R008:S01:X Protocol Aware Bit Error Rate Tester
:Keysight J:BERT M8041A Protocol Aware Bit Error Rate Tester
Qualification Requirements:/h2:
:BS in Electrical Engineering required; MS in Electrical Engineering is preferred
:10+ years of relevant design experience
:Excellent written and verbal communication
:Excellent problem solving skills
Job Location:/h2:
:Boise Idaho or Longmont Colorado or Folsom California
We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a persons race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veterans status, or other classifications protected under law.


• Location: folsom, Sacramento

• Post ID: 21764567 sacramento is an interactive computer service that enables access by multiple users and should not be treated as the publisher or speaker of any information provided by another information content provider. © 2018